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| ESDA14V2-2BF3 Quad bidirectional TransilTM array for ESD protection Features 2 bidirectional Transil functions ESD protection: IEC 61000-4-2 level 4 Stand off voltage: 12 V Min. Low leakage current Very small PCB area < 1.5 mm2 400 microns pitch Flip Chip (4 bumps) Complies with the following standards IEC 61000-4-2 - 15 kV (air discharge) - 8 kV (contact discharge) MIL STD 883E- Method 3015-7: class 3 - 25 kV (human body model) Figure 1. Pin layout (bump side) 2 1 A Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: B Computers Printers Communication systems and cellular phones Video equipment Figure 2. Configuration 1 A 2 Description The ESDA14V2-2BF3 is a monolithic array designed to protect 2 lines against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. This device is particularly adapted to the protection of symmetrical signals. B TM: Transil is ASD a trademark of STMicroelectronics. April 2008 Rev 3 1/9 www.st.com Characteristics ESDA14V2-2BF3 1 Characteristics Table 1. Symbol Absolute ratings (limiting values) Parameter MIL STD 883E - Method 3015-7 IEC 61000-4-2 air discharge IEC 61000-4-2 contact discharge Value 25 15 8 50 125 -55 to +150 260 -40 to +125 Unit VPP PPP Tj Tstg TL Top ESD discharge kV W C C C C Peak pulse power (8/20s) Junction temperature Storage temperature range Lead solder temperature (10 seconds duration) Operating temperature range Table 2. Symbol VBR IRM VRM VCL Rd IPP T C Electrical characteristics (Tamb = 25 C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Voltage temperature coefficient Capacitance VBR @ IR IRM @ VRM max V 18 mA 1 max. A 0.5 0.1 V 12 3 Rd Slope: 1 / Rd IPP VCL VBR VRM V I T C max. 0 V bias pF 12 Order code min. V typ.(1) max.(2) 3.2 10-4/C 6.5 ESDA14V2-2BF3 14.2 1. Square pulse, Ipp = 3 A, tp = 2.5 s. 2. VBR = T* (Tamb -25 C) * VBR (25 C) 2/9 ESDA14V2-2BF3 Characteristics Figure 3. Relative variation of peak pulse power versus intial junction temperature Figure 4. Peak pulse power versus exponential pulse duration Ppp[Tj initial] / Ppp [Tj initial=25C] 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 Tj(C) Ppp(W) 1000 Tj initial = 25C 100 tp(s) 10 1 10 100 Figure 5. Clamping voltage versus peak pulse current (typical values, rectangular waveform) Figure 6. Junction capacitance versus reverse applied voltage (typical values) 10.0 IPP(A) tp=2.5s Tj initial =25C C(pF) 14 13 12 11 10 9 8 F=1MHz VOSC=30mVRMS Tj=25C 1.0 7 6 5 4 3 VCL(V) 0.1 0 10 20 30 40 50 60 2 1 0 0 2 4 6 VR(V) 8 10 12 14 3/9 Characteristics ESDA14V2-2BF3 Figure 7. Relative variation of leakage current versus junction temperature (typical values) Figure 8. Analog crosstalk measurement IR [Tj ] / IR [Tj =25 C] 100 0.00 db -30.00 10 -60.00 -90.00 T j(C) 1 25 50 75 100 125 f (Hz) -120.00 100.0k 1.0M 10.0M 100.0M 1.0G Figure 9. ESD response to IEC 61000-4-2 (+15 kV air discharge) 4/9 ESDA14V2-2BF3 Figure 10. ESD response to IEC 61000-4-2 (-15 kV air discharge) Characteristics Figure 11. Digital crosstalk measurement 5/9 Application information ESDA14V2-2BF3 2 Application information Figure 12. Aplac model Ls A1 Rs Rs Ls A2 MODEL = D01 MODEL = D01 bu l k1 MODEL = D02 B1 Lg nd Rgnd Rgnd Lgnd B2 aplacvar Ls 150 p aplacvar Rs 60 m aplacvar Lgnd 290 p aplacvar Rgnd 250 m Model D01 BV=1 IBV=1 CJO=12.5 M=0.33 RS=0.3 VJ=0.6 TT=100 Model D02 BV=1 IBV=1 CJO=250 M=0.33 RS=80m VJ=0.6 TT=100 3 Ordering information scheme Figure 13. Ordering information scheme ESDA ESD Array Breakdown Voltage 14V2 = 14.2 Volts min. Number of line 2 = 2 lines Type B = Bidirectional Package F = Flip Chip x = 3: Lead-free, pitch = 400 m, bump height = 255 m 14V2 - 2 B F3 6/9 ESDA14V2-2BF3 Package information 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 14. Package dimensions 400 m 40 400 m 40 185 m 10 255 m 40 605 m 55 185 m 10 770 m 30 Figure 15. Footprint Copper pad Diameter: 220 m recommended 260 m maximum Solder mask opening: 300 m minimum 770 m 30 Figure 16. Marking Dot xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder stencil opening: 220 m recommended xxz y ww 7/9 Ordering information Figure 17. Flip Chip tape and reel specifications Dot identifying Pin A1 location 4 0.1 ESDA14V2-2BF3 O 1.5 0.1 1.75 0.1 3.5 0.1 0.87 xxz yww xxz yww xxz yww 0.71 0.05 All dimensions in mm 8 0.3 4 0.1 User direction of unreeling 0.87 Note: More information is available in the application note: AN2348 :"400 m Flip Chip: Package description and recommendations for use" AN1751 : EMI Filters: Recommendations and measurements 5 Ordering information Table 3. Ordering information Marking EG Package Flip Chip Weight 0.79 mg Base qty 5000 Delivery mode Tape and reel 7" Order code ESDA14V2-2BF3 6 Revision history Table 4. Date 02-Dec-2005 15-Dec-2005 29-Apr-2008 Document revision history Revision 1 2 3 Initial release. Ordering information changed. Updated ECOPACK statement. Updated Figure 13 and Figure 17. Reformatted to current standards. Changes 8/9 ESDA14V2-2BF3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9 |
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